Fast Turnaround
48h standard prototype, 24h urgent delivery for high-complexity PCBs
PCB/PCBAManufacturing &Assembly
One-stop solution from prototyping to mass production, specializing in multi-layer, high-complexity PCB and PCBA for military, medical, automotive and industrial applications.
Why Choose ShwayPCB
High Precision
01005 components, 0.2mm BGA, 2mil/2mil line width/spacing, ±3Ω impedance control
Strict Quality
99.8% yield rate, IPC-A-610 Class 3, ISO 13485/IATF 16949 certified
One-Stop Service
From design to prototyping, assembly, testing and global delivery
High Complexity
2-98 layers PCB (focus on 8-64 layers), blind/buried via, thick copper (10-20oz)
Global Service
1000+ global customers, 80% repeat purchase rate, confidential NDA agreement
Competitive Pricing
Factory-direct pricing with no middleman markup, transparent cost breakdown, volume discounts
Technical Support
24/7 engineering support, DFM analysis free of charge, lifetime technical consultation
Core Services
Multilayer PCB Prototype
- Layers: 2-98 Layers (Focus on 8-64 Layers)
- Line Width/Spacing: 2mil/2mil
- Hole Size: 0.1mm Microvia
- Impedance Control: ±3Ω
- Substrate: FR4 (High-Tg), Rogers, Taconic
- Turnaround: 48h (Standard), 24h (Urgent)
- Support blind/buried via, thick copper (10-20oz), step slot
High-precision PCBA Assembly
- Assembly Type: SMT, DIP, BGA/QFP/CSP Soldering
- Component Size: 01005 Package (Smallest)
- Inspection: AOI, X-Ray, ICT, FCT Testing
- Material Supply: Customer Supplied / Full Turnkey
- Volume: 1-5000 Sets (Prototype Low-Volume)
- ESD anti-static workshop, IPC-A-610 Class 3 standard
PCB Design Layout
- Design Scope: 2-64 layers PCB design
- Design Optimization: DFM/DFA, Impedance Matching, SI Analysis
- Application: Medical, Automotive, Military, Industrial Control
- Delivery: Gerber, BOM, Schematic, Design Spec
- Compliance: IPC-2221/2222, RoHS/REACH
BGA Rework Service
- Rework Type: BGA Desoldering, Resoldering, Replacement
- Precision Control: High-precision Hot Air Station
- Applicable Components: ≥0.2mm Pitch BGA/QFP/CSP
- Inspection: X-Ray Before/After Rework
- Protection: Preheating, Anti-static Operation
PCBA Reverse Engineering
- Scope: Schematic Recovery, Layout Extraction, BOM Organization
- Capability: Up to 32 layers PCB, HDI Boards
- Delivery: Gerber, Schematic, BOM, Assembly Drawings
- Quality: Circuit Function Consistency Verification
- Compliance: Legal Authorization, IP Protection
One-stop Solution
- Design Support: DFM/DFA Audit, Impedance Optimization
- Material Sourcing: Global Genuine Components
- Testing: Reliability, Aging, Environmental Testing
- Compliance: ISO 13485, IATF 16949
- Logistics: Global Delivery with Insurance
High-Frequency & High-Speed Solutions
- Frequency Range: DC-60GHz High-Frequency Design
- Material: Rogers, Taconic, Isola High-Speed Material
- Impedance: ±2Ω Ultra-Precision Impedance Control
- SI/PI Analysis: Signal/Power Integrity Simulation
- Application: 5G/6G, Radar, High-Speed Server
- Process: Microvia, Air Gap, Laser Drilling
OEM & ODM Solutions
- OEM Service: Custom Production as Per Customer Design
- ODM Service: Full Design & Manufacturing Turnkey
- Product Development: From Concept to Mass Production
- Supply Chain: One-Stop Material Sourcing & Management
- Quality: Batch Consistency & Traceability Guarantee
- Flexibility: Small MOQ & Fast Customization Support
Box Build Electronics Assembly
- Assembly Scope: Complete Product Integration & Testing
- Process: PCBA + Mechanical Assembly + Cable Harness
- Testing: Functional Testing, Burn-in Testing, Aging Test
- Packaging: Custom Packaging & Labeling as Per Requirement
- Compliance: CE/FCC/UL Certification Support
- Logistics: Global Delivery & After-Sales Support
Detailed Technical Parameters
Comprehensive technical specifications to meet various application needs from consumer electronics to aerospace
| Project | Standard capabilities | Advanced abilities | Remark |
|---|---|---|---|
| Number of layers | 2-16 layers | 18-98 layers | Supports blind and buried vias, and arbitrary layer interconnection. |
| Board thickness range | 0.2-3.2mm | 0.1-12.0mm | Tolerance: ±10% |
| Minimum line width/spacing | 3/3mil (0.075mm) | 2/2mil (0.05mm) | Direct laser imaging |
| Minimum aperture | 0.2mm mechanical drilling | 0.1mm laser micro-hole | Aspect ratio: 20:1 |
| Impedance control | ±10% | ±3Ω | Single-ended/differential impedance |
| Surface treatment | Lead-containing/lead-free solder plating, immersion gold | Immersion silver, immersion tin, OSP, electroplated hard gold | RoHS compliant |
| Copper thickness range | 0.5-2.0oz | 3.0-12.0oz | Thick copper plate |
| Warpage control | ≤0.75% | ≤0.3% | High-precision pressing process |